- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/32 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers; Selection of materials for these layers using masks
Patent holdings for IPC class H01L 21/32
Total number of patents in this class: 485
10-year publication summary
|
41
|
64
|
58
|
54
|
57
|
67
|
42
|
32
|
32
|
1
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
86 |
| Applied Materials, Inc. | 16587 |
46 |
| Tokyo Electron Limited | 11599 |
26 |
| International Business Machines Corporation | 60644 |
23 |
| Lam Research Corporation | 4775 |
17 |
| ASM IP Holding B.V. | 1715 |
17 |
| Intel Corporation | 45621 |
15 |
| Micron Technology, Inc. | 24960 |
12 |
| Texas Instruments Incorporated | 19376 |
9 |
| GLOBALFOUNDRIES U.S. Inc. | 6459 |
9 |
| Samsung Electronics Co., Ltd. | 131630 |
8 |
| United Microelectronics Corp. | 3921 |
7 |
| Commissariat à l'énergie atomique et aux energies alternatives | 10525 |
7 |
| Samsung Display Co., Ltd. | 30585 |
6 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1764 |
6 |
| Tokyo Electron U.S. Holdings, Inc | 608 |
5 |
| Renesas Electronics Corporation | 6305 |
4 |
| SK Hynix Inc. | 11030 |
4 |
| Rohm Co., Ltd. | 5843 |
4 |
| Semiconductor Components Industries, L.L.C. | 5345 |
4 |
| Other owners | 170 |